Study Of Thermal Interface Conductance Between Realistic Bolted Joints - Couverture souple

N., Sujana ; T. N., Shashank

9786203463767: Study Of Thermal Interface Conductance Between Realistic Bolted Joints

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ISBN 10 : 6203463760 ISBN 13 : 9786203463767

Editeur : LAP LAMBERT Academic Publishing, 2021

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�diteur: LAP LAMBERT Academic Publishing
Date d'�dition: 2021
Langue: anglais
ISBN 10: 6203463760
ISBN 13: 9786203463767
Reliure: Broch�
Nombre de pages: 56
Coordonn�es du fabricant: non disponible
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Study Of Thermal Interface Conductance Between Realistic Bolted Joints

Sujana N.

Edit� par LAP LAMBERT Academic Publishing Mrz 2021, 2021

ISBN 10 : 6203463760 ISBN 13 : 9786203463767

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Study of heat conductance plays a major role in spacecraft thermal design under vacuum environment. Since the space environment is found to be a vacuum, the convective heat transfer is absent. Hence the conduction plays an important role in heat-transfer mechanism. The heat generated within spacecraft/satellites from an electronics box must flow through conducting medium to the box surface. This generated heat should either radiate or conduct to a heat sink. Conduction path includes number of joints in the box surface where heat must be transferred by contact between the surfaces. These joints include screws guides and bolts to attach circuit boards to an electronics-box chassis in spacecraft shelf Hence the thermal conductaithof contacting surfaces is an important parameter for spacecraft thermal design. The objective of this work is to study the temperature variations and pressure distribution on too rectangular plates (Al 6061) of different thickness (10mm and 3mm). The plates were bought together and joined using M4 bolts, with the vacuum environment by varying the cold temperature and heater positions. 56 pp. Englisch. N� de r�f. du vendeur 9786203463767

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Study Of Thermal Interface Conductance Between Realistic Bolted Joints

N., Sujana; T. N., Shashank

Edit� par LAP LAMBERT Academic Publishing, 2021

ISBN 10 : 6203463760 ISBN 13 : 9786203463767

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Study Of Thermal Interface Conductance Between Realistic Bolted Joints

N., Sujana; T. N., Shashank

Edit� par LAP LAMBERT Academic Publishing, 2021

ISBN 10 : 6203463760 ISBN 13 : 9786203463767

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Study Of Thermal Interface Conductance Between Realistic Bolted Joints

N., Sujana; T. N., Shashank

Edit� par LAP LAMBERT Academic Publishing, 2021

ISBN 10 : 6203463760 ISBN 13 : 9786203463767

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Study Of Thermal Interface Conductance Between Realistic Bolted Joints

Sujana N.|Shashank T. N.

Edit� par LAP LAMBERT Academic Publishing, 2021

ISBN 10 : 6203463760 ISBN 13 : 9786203463767

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: N. SujanaSujana N working as an assistant professor in the department of Industrial and Production Engineering at PES College of Engineering, Mandya. Completed his Master degree from Siddaganga Institute of Technology,Tumkuru in Ther. N� de r�f. du vendeur 491819602

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Study Of Thermal Interface Conductance Between Realistic Bolted Joints

Sujana N.

Edit� par LAP LAMBERT Academic Publishing M�r 2021, 2021

ISBN 10 : 6203463760 ISBN 13 : 9786203463767

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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Study of heat conductance plays a major role in spacecraft thermal design under vacuum environment. Since the space environment is found to be a vacuum, the convective heat transfer is absent. Hence the conduction plays an important role in heat-transfer mechanism. The heat generated within spacecraft/satellites from an electronics box must flow through conducting medium to the box surface. This generated heat should either radiate or conduct to a heat sink. Conduction path includes number of joints in the box surface where heat must be transferred by contact between the surfaces. These joints include screws guides and bolts to attach circuit boards to an electronics-box chassis in spacecraft shelf Hence the thermal conductaithof contacting surfaces is an important parameter for spacecraft thermal design. The objective of this work is to study the temperature variations and pressure distribution on too rectangular plates (Al 6061) of different thickness (10mm and 3mm). The plates were bought together and joined using M4 bolts, with the vacuum environment by varying the cold temperature and heater positions.VDM Verlag, Dudweiler Landstra�e 99, 66123 Saarbr�cken 56 pp. Englisch. N� de r�f. du vendeur 9786203463767

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Study Of Thermal Interface Conductance Between Realistic Bolted Joints

Sujana N.

Edit� par LAP LAMBERT Academic Publishing, 2021

ISBN 10 : 6203463760 ISBN 13 : 9786203463767

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Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Study of heat conductance plays a major role in spacecraft thermal design under vacuum environment. Since the space environment is found to be a vacuum, the convective heat transfer is absent. Hence the conduction plays an important role in heat-transfer mechanism. The heat generated within spacecraft/satellites from an electronics box must flow through conducting medium to the box surface. This generated heat should either radiate or conduct to a heat sink. Conduction path includes number of joints in the box surface where heat must be transferred by contact between the surfaces. These joints include screws guides and bolts to attach circuit boards to an electronics-box chassis in spacecraft shelf Hence the thermal conductaithof contacting surfaces is an important parameter for spacecraft thermal design. The objective of this work is to study the temperature variations and pressure distribution on too rectangular plates (Al 6061) of different thickness (10mm and 3mm). The plates were bought together and joined using M4 bolts, with the vacuum environment by varying the cold temperature and heater positions. N� de r�f. du vendeur 9786203463767

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