A Comprehensive Study on Heat Transfer in Electronic Cooling Systems: Flow optimization of heat sinks for different Al/Cu compositions - Couverture souple

Hanumanthrappa, Ramesha; K, Ananda G; R, Varun K

 
9786204740263: A Comprehensive Study on Heat Transfer in Electronic Cooling Systems: Flow optimization of heat sinks for different Al/Cu compositions
Couverture souple
ISBN 10 : 6204740261 ISBN 13 : 9786204740263
Editeur : LAP LAMBERT Academic Publishing, 2022

Synopsis

In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Éditeur
LAP LAMBERT Academic Publishing
Date d'édition
2022
Langue
anglais
ISBN 10 
6204740261
ISBN 13 
9786204740263
Reliure
Broché
Nombre de pages
128
Coordonnées du fabricant
non disponible
Personne responsable
KreGa Onlinehandel GmbH
4950000000000
info@krega-onlinehandel.de

Birkenweg 31
Brakel
33034
Allemagne