Wire Bonding in Microelectronics: Reliability Analysis and Process Optimization - Couverture souple

Mouhat, Ouadia

Couverture souple

ISBN 10 : 6630598644 ISBN 13 : 9786630598643

Editeur : Our Knowledge Publishing, 2026

Synopsis

The semiconductor assembly process involves several steps, but the most important one is wire bonding. This step is considered the most delicate compared to other processes because it involves connecting the chip's bond pads to the package substrate. This book presents the optimization of the copper wire bonding (CWB) process, in which gold wire is replaced with copper wire, and the optimal process parameters are determined through reliability analysis, with the ultimate goal of improving product quality. Once the process study is complete and machine operation has been mastered, the next step is to define a design of experiments using specific software to identify the main factors influencing the copper wire bonding process. Finally, the bond pads are validated in accordance with quality requirements regarding reliability.

Détails de l'édition

• Éditeur: Our Knowledge Publishing
• Date d'édition: 2026
• Langue: anglais
• ISBN 10: 6630598644
• ISBN 13: 9786630598643
• Reliure: Tapa blanda
• Nombre de pages: 60
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible