Vendeur : liu xing, Nanjing, JS, Chine
Hardcover. Etat : New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.HardCover. Pub Date :2013-06-01 Pages: 196 Language: Chinese Publisher: Science Press . Microelectronics Reliability : interconnect devices and systems . mainly discussed the electronic interconnect components to the package system reliability issues. The first chapter presents the reliability of related concepts . and then discusses the conductive adhesive joints including solder joint reliability and the research methods and the most common failure mechanisms . then a detailed description o.Four Satisfaction guaranteed,or money back. N° de réf. du vendeur BR045908
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