MEMS integration and packaging technology based(Chinese Edition) - Couverture souple

LOU WEN ZHONG , SUN YUN QIANG

 
9787111209171: MEMS integration and packaging technology based(Chinese Edition)

Synopsis

Language:Chinese.Soft cover.publisher:Mechanical Industry Press Pub. Date :2007-03-01.description:Paperback. Publisher: Mechanical Industry Press Pub. Date: 2007-03-01. This book introduces the MEMS integration and packaging technology. The book consists of three parts. namely: MEMS integration technology based on MEMS packaging technology based

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