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International Mechanical Engineering Advanced Technology Renditions : 3D IC design(Chinese Edition)
Edité par
Machinery Industry Press, 2013
ISBN 10 : 7111433513
ISBN 13 : 9787111433514
Neuf
paperback
Vendeur : liu xing, Nanjing, JS, Chine
Évaluation du vendeur 5 sur 5 étoiles
paperback. Etat : New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Pub Date :2013-09-01 Pages: 224 Publisher: Machinery Industry Press at the end of the first decade of the 21st century . based on 3D integration technology. More than Moore era quietly arrived. Have multiple active devices planes 3D IC (3DIC). is expected to provide a compact. flexible cabling . transmission speed and the number of multi- channel interconnect structures . thus providing breakthrough interconnect bottleneck for the effective IC designers means . but also to the effective integ.Four Satisfaction guaranteed,or money back. N° de réf. du vendeur RW055186
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EUR 87,50
Expédition à EUR 16,07
Expédition depuis Chine vers Etats-Unis
Expédition depuis Chine vers Etats-Unis
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