微电子引线键合（原书第3版）乔治哈曼著超声键合系统测试方法工艺建模微电子芯片封装技术引线键合金属界面反应罗建强机工社 - Couverture rigide

9787111697091: 微电子引线键合（原书第3版）乔治哈曼著超声键合系统测试方法工艺建模微电子芯片封装技术引线键合金属界面反应罗建强机工社

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ISBN 10 : 711169709X ISBN 13 : 9787111697091

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Langue: chinois
ISBN 10: 711169709X
ISBN 13: 9787111697091
Reliure: Reli�
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Microelectronics Wire Bonding (Original Book 3rd Edition)(Chinese Edition)

[ MEI ] QIAO ZHI HA MAN ( George Harman )

Edit� par Machinery Industry Press, 2022

ISBN 10 : 711169709X ISBN 13 : 9787111697091

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Vendeur : liu xing, Nanjing, JS, Chine

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Hardcover. Etat : New. Language:Chinese.HardCover.Pub Date:2022-06-01 Publisher:Machinery Industry Press Microelectronics Wire Bonding (3rd Edition) translated from Professor George Harman's book Wire Bonding in Microelectronics (3rd Edition) . systematically summarizes the development context and latest achievements of wire bonding technology in the past 70 years. and makes an outlook on the future development trend. The main contents include: ultrasonic bonding system and technology. metallurgical characteristics. N� de r�f. du vendeur NX045985

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