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Design for testability and test optimization technology for 3D stacked integrated circuits based on TSV(Chinese Edition)
Edité par
Mechanical Industry Press, 2024
ISBN 10 : 711175364X
ISBN 13 : 9787111753643
Neuf
paperback
Vendeur : liu xing, Nanjing, JS, Chine
Évaluation du vendeur 5 sur 5 étoiles
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2024-06 Publisher: China Machine Press Testing is a method used to ensure the stability and effectiveness of integrated circuits. and is an indispensable and important means throughout all aspects of integrated circuit manufacturing. The particularity of the TSV-based 3D stacked integrated circuit structure and the variability of the design process bring new problems and challenges to the testing process. This book first discusses the basic concepts. basi. N° de réf. du vendeur DR007345
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EUR 142,64
Expédition à EUR 15,55
Expédition depuis Chine vers Etats-Unis
Expédition depuis Chine vers Etats-Unis
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