EUR 12,78 expédition depuis Chine vers France
Destinations, frais et délaisVendeur : liu xing, Nanjing, JS, Chine
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e. N° de réf. du vendeur DR009393
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