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Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
Edité par
Mechanical Industry Press, 2024
ISBN 10 : 7111755804
ISBN 13 : 9787111755807
Neuf
paperback
Vendeur : liu xing, Nanjing, JS, Chine
Évaluation du vendeur 5 sur 5 étoiles
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e. N° de réf. du vendeur DR009393
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EUR 144,13
Expédition à EUR 15,81
Expédition depuis Chine vers Etats-Unis
Expédition depuis Chine vers Etats-Unis
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