Language:Chinese.No Binding.publisher:Electronics Industry Publishing House Pub. Date :2.description:Pages Number: 10227 Publisher: Electronic Industry Publishing House Pub. Date :2009-09. This book in-depth analysis of driver re-flow soldering technology development and improvement of power based on a comprehensive and systematic introduction to th
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Vendeur : liu xing, Nanjing, JS, Chine
paperback. Etat : New. Language:Chinese.Pages Number: 10227 Publisher: Electronic Industry Publishing House Pub. Date :2009-09. This book in-depth analysis of driver re-flow soldering technology development and improvement of power based on a comprehensive and systematic introduction to the re-flow characteristics of the composition of welding equipment and future development trend. but also to explore its application of research technology and content. re-flow soldering methods and quality control requirements. th. N° de réf. du vendeur J52553
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