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IC chip packaging technology ( 2nd Edition ) application personnel training colleges planning materials(Chinese Edition)
Vendeur : liu xing, Nanjing, JS, Chine
Évaluation du vendeur 5 sur 5 étoiles
paperback. Etat : New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-07-01 Pages: 252 Language: Chinese Publisher: Electronic Industry Press IC chip packaging technology ( 2nd Edition ) Applied Talents universities planning materials is a general-purpose integrated circuits chip packaging technology materials. The book has 13 chapters. including integrated circuit chip package overview. packaging process. thick film technology . welding materials. printed circuit boards. components and circuit board bonding . sealing plastic materials.Four Satisfaction guaranteed,or money back. N° de réf. du vendeur BR077070
Acheter neuf
EUR 59,72
Expédition à EUR 15,99
Expédition depuis Chine vers Etats-Unis
Expédition depuis Chine vers Etats-Unis
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