先进电子封装技术与关键材料丛书--微电子封装和集成的建模与仿真(英文版) - Couverture rigide

9787122392275: 先进电子封装技术与关键材料丛书--微电子封装和集成的建模与仿真(英文版)

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ISBN 10 : 7122392279 ISBN 13 : 9787122392275

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Langue: anglais
ISBN 10: 7122392279
ISBN 13: 9787122392275
Reliure: Reli�
Coordonn�es du fabricant: non disponible
Personne responsable: non disponible

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Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)

LIU SHENG . LIU YONG

Edit� par Chemical Industry Press, 2021

ISBN 10 : 7122392279 ISBN 13 : 9787122392275

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Vendeur : liu xing, Nanjing, JS, Chine

�valuation du vendeur 5 sur 5 �toiles

Hardcover. Etat : New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and . N� de r�f. du vendeur AMZ012358_NX046087_012358

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