Synopsis
Language:Chinese.paperback.Pub Date:2024-10.publisher:Chemical Industry Press.description:Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of elect
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Advanced electronic packaging technology(Chinese Edition)
Vendeur : liu xing, Nanjing, JS, Chine
Évaluation du vendeur 5 sur 5 étoiles
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi. N° de réf. du vendeur DT050389
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EUR 149,66
Expédition à EUR 15,44
Expédition depuis Chine vers Etats-Unis
Expédition depuis Chine vers Etats-Unis
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