Vendeur : liu xing, Nanjing, JS, Chine
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2018-08-01 Pages: 155 Publisher: Tsinghua University Press. a total of 11 chapters. including integrated circuit chip manufacturing overview. substrate material silicon wafer structure and fabrication. common microelectronic device structure. integration Circuit chip manufacturing process. silicon wafer contamination and cleaning. photolithography process. etching process. doping process. film growth process. surface. N° de réf. du vendeur NK023261
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