Language:Chinese.paperback.Pub Date:2022-02-01.publisher:Intellectual Property Press.description:Paperback.Pub Date:2022-02-01 Pages:156 Language:Chinese Publisher:Intellectual Property Publishing House This book focuses on the three major technical fields of the integrated circuit industry - design. manufacturing and packaging from the global.
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Vendeur : liu xing, Nanjing, JS, Chine
paperback. Etat : New. Paperback.Pub Date:2022-02-01 Pages:156 Language:Chinese Publisher:Intellectual Property Publishing House This book focuses on the three major technical fields of the integrated circuit industry - design. manufacturing and packaging from the global. China and Guangdong levels. Analysis of the patent situation of the integrated circuit industry. analysis of the current situation and future trends of the integrated circuit industry process technology. important domestic and foreign applicants a. N° de réf. du vendeur NX022523
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