Language:Chinese.paperback.Pub Date:2024-09.publisher:Intellectual Property Publishing House.description:Paperback. Pub Date: 2024-09 Pages: 218 Publisher: Intellectual Property Publishing House This book innovatively conducts a dual-line linkage and dual-dimensional positioning analysis. focusing on the patent layout of key core technologies in the sem
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Vendeur : liu xing, Nanjing, JS, Chine
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2024-09 Pages: 218 Publisher: Intellectual Property Publishing House This book innovatively conducts a dual-line linkage and dual-dimensional positioning analysis. focusing on the patent layout of key core technologies in the semiconductor industry and the layout of key applicants. The research content closely follows the current urgent needs of the industry and future development trends. providing strong support for existing scientific research and effec. N° de réf. du vendeur DT023227
Quantité disponible : 1 disponible(s)