Articles liés à Chip packaging and testing(Chinese Edition)
Synopsis
Language:Chinese.paperback.Pub Date:2022-11.publisher:Northwestern Polytechnical University Press.description:Paperback. Pub Date: 2022-11 Pages: 130 Language: Chinese Publisher: Northwestern Polytechnical University Press Chip Packaging and Testing is a general textbook on integrated circuit chip packaging and testing. The book has 9 chapters. and the main
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Chip packaging and testing(Chinese Edition)
Edité par
Northwestern Polytechnical University Press, 2022
ISBN 10 : 7561282117
ISBN 13 : 9787561282113
Neuf
paperback
Vendeur : liu xing, Nanjing, JS, Chine
Évaluation du vendeur 5 sur 5 étoiles
paperback. Etat : New. Paperback. Pub Date: 2022-11 Pages: 130 Language: Chinese Publisher: Northwestern Polytechnical University Press Chip Packaging and Testing is a general textbook on integrated circuit chip packaging and testing. The book has 9 chapters. and the main contents include an introduction to chip packaging. microelectronics manufacturing technology. chip packaging materials. chip packaging processes. chip and circuit board assembly. advanced packaging technology. chip packaging reliability testing. . N° de réf. du vendeur DR008259
Acheter neuf
EUR 69,49
Expédition à EUR 15,62
Expédition depuis Chine vers Etats-Unis
Expédition depuis Chine vers Etats-Unis
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