Language:Chinese.No Binding.publisher:Harbin Engineering University Press Pub. Date :200.description:Pages Number: 240 Publisher: Harbin Engineering University Press Pub. Date :2009-08. This book is composed of three parts: First. the identification chip components and desoldering; Second. various types of SMD diodes. and diode combination
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Vendeur : liu xing, Nanjing, JS, Chine
paperback. Etat : New. Language:Chinese.Pages Number: 240 Publisher: Harbin Engineering University Press Pub. Date :2009-08. This book is composed of three parts: First. the identification chip components and desoldering; Second. various types of SMD diodes. and diode combination. N° de réf. du vendeur J50194
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