Articles liés à Compact Models and Performance Investigations for Sub-thresh...

Compact Models and Performance Investigations for Sub-threshold Interconnects - Couverture rigide

 
9788132221319: Compact Models and Performance Investigations for Sub-threshold Interconnects

Synopsis

The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l?auteur

Dr. Rohit Dhiman received his B.Tech. Degree in Electronics & Communication Engineering from H.P.U. Shimla, India in 2007. He did his M.Tech. in VLSI Design Automation & Techniques, from National Institute of Technology (NIT) Hamirpur, India in 2009. He was awarded his Ph.D. Degree from NIT Hamirpur in 2014. He has also worked as Post-Doctoral Researcher at Indian Institute of Technology (IIT) Ropar, India. Presently Dr. Rohit Dhiman has been working as an Assistant Professor at NIT Hamirpur. He has over 20 research papers in international journals of repute and conferences to his credit. His research interest is in device and circuit modeling for low power VLSI design.

Dr. Rajeevan Chandel received her B.E. Degree in E&CE from Thapar Institute of Engg. & Technology, Patiala, India in 1990. She is a double gold medalist of Himachal Pradesh University, Shimla in Pre-Univ and Pre-Engg. She did her M.Tech. in Integrated Electronics and Circuits, from IIT Delhi in 1997. She was awarded Ph.D. Degree from IIT Roorkee, India in 2005. Dr. Chandel joined Dept. of E&CE, NIT, Hamirpur, HP as Lecturer in 1990, where presently she is working as Professor & Head. She has over 40 research papers in international journals of repute and over 90 in conferences. Her research interest is in electronics circuit modeling and low power VLSI design. She is a life member of IETE (I) and ISTE (I) and member of VSI.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Acheter D'occasion

état :  Très bon
Zustand: Sehr gut | Sprache: Englisch...
Afficher cet article
EUR 11,70

Autre devise

EUR 9,90 expédition depuis Allemagne vers France

Destinations, frais et délais

Acheter neuf

Afficher cet article
EUR 85,59

Autre devise

EUR 11 expédition depuis Allemagne vers France

Destinations, frais et délais

Autres éditions populaires du même titre

9788132229971: Compact Models and Performance Investigations for Subthreshold Interconnects

Edition présentée

ISBN 10 :  8132229975 ISBN 13 :  9788132229971
Editeur : Springer, 2016
Couverture souple

Résultats de recherche pour Compact Models and Performance Investigations for Sub-thresh...

Image d'archives

Rajeevan Chandel, Rohit Dhiman
Edité par Springer India, 2014
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Ancien ou d'occasion Couverture rigide

Vendeur : Buchpark, Trebbin, Allemagne

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Etat : Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher. N° de réf. du vendeur 25052194/2

Contacter le vendeur

Acheter D'occasion

EUR 11,70
Autre devise
Frais de port : EUR 9,90
De Allemagne vers France
Destinations, frais et délais

Quantité disponible : 1 disponible(s)

Ajouter au panier

Image d'archives

Rajeevan Chandel, Rohit Dhiman
Edité par Springer India, 2014
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Ancien ou d'occasion Couverture rigide

Vendeur : Buchpark, Trebbin, Allemagne

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Etat : Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher. N° de réf. du vendeur 25052194/12

Contacter le vendeur

Acheter D'occasion

EUR 11,70
Autre devise
Frais de port : EUR 9,90
De Allemagne vers France
Destinations, frais et délais

Quantité disponible : 1 disponible(s)

Ajouter au panier

Image d'archives

Dhiman, Rohit; Chandel, Rajeevan
Edité par New Delhi, Springer., 2015
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Ancien ou d'occasion Couverture rigide

Vendeur : Universitätsbuchhandlung Herta Hold GmbH, Berlin, Allemagne

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

xiii, 113p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Bumped.Little flexed. Sprache: Englisch. N° de réf. du vendeur 2173CB

Contacter le vendeur

Acheter D'occasion

EUR 13
Autre devise
Frais de port : EUR 10
De Allemagne vers France
Destinations, frais et délais

Quantité disponible : 2 disponible(s)

Ajouter au panier

Image fournie par le vendeur

Rajeevan Chandel
Edité par Springer India Nov 2014, 2014
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Neuf Couverture rigide
impression à la demande

Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling. 128 pp. Englisch. N° de réf. du vendeur 9788132221319

Contacter le vendeur

Acheter neuf

EUR 85,59
Autre devise
Frais de port : EUR 11
De Allemagne vers France
Destinations, frais et délais

Quantité disponible : 2 disponible(s)

Ajouter au panier

Image fournie par le vendeur

Rohit Dhiman|Rajeevan Chandel
Edité par Springer India, 2014
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Neuf Couverture rigide
impression à la demande

Vendeur : moluna, Greven, Allemagne

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides compact analytical approach for sub-threshold electrical on-chip interconnectsIncludes comprehensive analysis of coupling noise for sub-threshold circuitsInvestigates variability issues in sub-threshold domain to develop efficient . N° de réf. du vendeur 5803297

Contacter le vendeur

Acheter neuf

EUR 92,27
Autre devise
Frais de port : EUR 9,70
De Allemagne vers France
Destinations, frais et délais

Quantité disponible : Plus de 20 disponibles

Ajouter au panier

Image d'archives

Dhiman, Rohit; Chandel, Rajeevan
Edité par Springer, 2014
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Neuf Couverture rigide

Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Etat : New. In. N° de réf. du vendeur ria9788132221319_new

Contacter le vendeur

Acheter neuf

EUR 112,28
Autre devise
Frais de port : EUR 4,62
De Royaume-Uni vers France
Destinations, frais et délais

Quantité disponible : Plus de 20 disponibles

Ajouter au panier

Image fournie par le vendeur

Rajeevan Chandel
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Neuf Couverture rigide

Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling. N° de réf. du vendeur 9788132221319

Contacter le vendeur

Acheter neuf

EUR 109,94
Autre devise
Frais de port : EUR 10,99
De Allemagne vers France
Destinations, frais et délais

Quantité disponible : 1 disponible(s)

Ajouter au panier

Image fournie par le vendeur

Rajeevan Chandel
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Neuf Couverture rigide
impression à la demande

Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Buch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 128 pp. Englisch. N° de réf. du vendeur 9788132221319

Contacter le vendeur

Acheter neuf

EUR 106,99
Autre devise
Frais de port : EUR 15
De Allemagne vers France
Destinations, frais et délais

Quantité disponible : 1 disponible(s)

Ajouter au panier

Image d'archives

Rohit Dhiman Rajeevan Chandel
Edité par Springer, 2015
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Neuf Couverture rigide

Vendeur : UK BOOKS STORE, London, LONDO, Royaume-Uni

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Hardcover. Etat : New. Brand New! Fast Delivery US Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 7-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability. N° de réf. du vendeur MA 9788132221319

Contacter le vendeur

Acheter neuf

EUR 124,46
Autre devise
Frais de port : EUR 5,78
De Royaume-Uni vers France
Destinations, frais et délais

Quantité disponible : 10 disponible(s)

Ajouter au panier

Image d'archives

Rohit Dhiman Rajeevan Chandel
Edité par Springer, 2015
ISBN 10 : 8132221311 ISBN 13 : 9788132221319
Neuf Couverture rigide

Vendeur : URW Books Store, CASPER, WY, Etats-Unis

Évaluation du vendeur 5 sur 5 étoiles Evaluation 5 étoiles, En savoir plus sur les évaluations des vendeurs

Hardcover. Etat : New. Brand New! Fast Delivery, Delivery within 7-12 working Day Only, USA Edition Original Edition. Excellent Quality, Printing in English Language, Quick delivery by FEDEX & DHL. USPS & UPS Act. Our courier service is not available at PO BOX& APO BOX. Ship from India & United States. N° de réf. du vendeur Manohrbook11526

Contacter le vendeur

Acheter neuf

EUR 124,36
Autre devise
Frais de port : EUR 12,81
De Etats-Unis vers France
Destinations, frais et délais

Quantité disponible : 5 disponible(s)

Ajouter au panier

There are 2 autres exemplaires de ce livre sont disponibles

Afficher tous les résultats pour ce livre