Advancements in AI and IoT for Chip Manufacturing and Defect Prevention - Couverture souple

Jain, Rupal

Couverture souple

ISBN 10 : 8770046816 ISBN 13 : 9788770046817

Editeur : River Publishers, 2024

Synopsis

This is essential reading for semiconductor professionals seeking to expand their knowledge on silicon processes, understand defect prevention, and explore optimizing processes by reducing defects using AI and IoT technologies. It charts a course where semiconductor manufacturing defects are minimized and maximizes productivity.

A propos du livre

À propos de l'auteur

Rupal Jain is a distinguished figure in the field of semiconductor chip manufacturing, with extensive expertise in engineering, program management, and strategic alignment. Throughout her career, she has spearheaded projects encompassing the entire chip development lifecycle - from design conception and quality management to global delivery across regions like the USA, Taiwan, Singapore, Italy, Malaysia, China, and India. Her profound knowledge is recognized by prestigious certifications like PMP, CSM, and Lean Six Sigma Black Belt. Rupal holds a master's degree in electrical and Electronics Engineering, earned through a joint program between NTU Singapore and TUM Germany. Beyond her technical prowess, Rupal's innovative contributions have garnered international acclaim. She is a frequent contributor to esteemed publications, serves on prestigious juries, and holds nominated memberships in industry organizations. Notably, her work has been recognized with coveted awards and patents, further solidifying her position as a leader in the field. Her other authored pieces- ""Mastering Project Management: PMP and Agile for Leaders"" and ""Semiconductor Essentials: A Leader's Express reference to Electronics Concepts"" promise to share her valuable insights with the next generation of leaders and engineers.

Détails de l'édition

• Éditeur: River Publishers
• Date d'édition: 2024
• Langue: anglais
• ISBN 10: 8770046816
• ISBN 13: 9788770046817
• Reliure: Broché
• Nombre de pages: 152
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible