From Artificial Intelligence to Brain Intelligence - Couverture rigide

Couverture rigide

ISBN 10 : 8770221235 ISBN 13 : 9788770221238

Editeur : River Publishers, 2020

Synopsis

Research in Artificial Intelligence (AI) is not new, it has been around since 1950's. AI resurfaced at that time while Moore's law was on an aggressive path of scaling, with the transformation of NMOS and later bipolar technology to CMOS for high performance, low power as well as low cost applications.Several breakthroughs in the electronics industry helped to push Moore's law in chip miniaturization along with increased computing power (parallel and distributed processing) and memory bandwidth. Once this paradigm shift occurred it naturally opened doors for AI as it required big data manipulations, and thus AI could thrive again. AI has already shown success in industries such as finance, marketing, health care, transportation, gaming, education and the defence and space, to name but a few.The human brain amazingly has a memory in the order of millions of digital bits, however it cannot compete with machines for data crunching and speed. Thus tomorrow's world will be a World of Wonders of Artificial Intelligence (WOW- AI), to compensate the computational limitations of human beings. In short, AI research and applications will continue to grow with the development of software, algorithms and hardware accelerators.To continue the development of AI, an advanced AI Compute Symposium was launched with the sponsorship of IBM, IEEE CAS and EDS, from which this book came. Overall, the book covers two broad topics: general AI advances, and applications to neuromorphic computing.

A propos du livre

À propos des auteurs

Dr. Rajiv V. Joshi is a research staff member and key technical lead at T. J. Watson research center, IBM. He received his B.Tech I.I.T (Bombay, India), M.S (M.I.T) and Dr. Eng. Sc. (Columbia University). His novel interconnects processes and structures for aluminum, tungsten and copper technologies which are widely used in IBM for various technologies from sub-0.5μm to 14nm. He has led successfully predictive failure analytic techniques for yield prediction and also the technology-driven SRAM at IBM Server Group. He has extensively worked on novel memory designs. He commercialized these techniques. He received 3 Outstanding Technical Achievement (OTAs), 3 highest Corporate Patent Portfolio awards for licensing contributions, holds 60 invention plateaus and has over 235 US patents and over 354 including international patents. His interests are in in-memory computation, CNN, DNN accelerators and Quantum computing. He has authored and co-authored over 200 papers. He has given over 45 invited/keynote talks and given several Seminars. He is awarded prestigious IEEE Daniel Noble award for 2018. He received the Best Editor Award from IEEE TVLSI journal. He is recipient of 2015 BMM award. He is inducted into New Jersey Inventor Hall of Fame in Aug 2014 along with pioneer Nicola Tesla. He is a recipient of 2013 IEEE CAS Industrial Pioneer award and 2013 Mehboob Khan Award from Semiconductor Research Corporation. He is a member of IBM Academy of technology and a master inventor. He served as a Distinguished Lecturer for IEEE CAS and EDS society. He is currently Distinguished Lecturer for CEDA. He is IEEE, ISQED and World Technology Network fellow and distinguished alumnus of IIT Bombay. He serves in the Board of Governors for IEEE CAS as industrial liaison. He serves as an Associate Editor of TVLSI. He will and has served on committees of DAC 2019, AICAS 2019, ISCAS, ISLPED (Int. Symposium Low Power Electronic Design), IEEE VLSI design, IEEE CICC, IEEE Int. SOI conference, ISQED and Advanced Metallization Program committees. He initiated IBM CAS EDS symposium at IBM in 2017 and will continue into 2018 with Artificial Intelligence as the focal area. He served as a general chair for IEEE ISLPED. He is an industry liaison for universities as a part of the Semiconductor Research Corporation. Also he is in the industry liaison committee for IEEE CAS society.

Arvind Kumar Arvind Kumar is a Research Staff Member and Manager at the IBM T.J. Watson Research Center in Yorktown Heights, NY. He has worked extensively on device design, characterization, and modeling for several IBM technologies. He has recently shifted his research interests to AI and heterogeneous integration. In addition to numerous invited talks and panel presentations, he has been involved with the IEEE Rebooting Computing initiative, serving as General Chair of ICRC 2017. He currently manages a team focused on next generation AI hardware. He holds a PhD in Electrical Engineering and Computer Science from MIT.

Détails de l'édition

• Éditeur: River Publishers
• Date d'édition: 2020
• Langue: anglais
• ISBN 10: 8770221235
• ISBN 13: 9788770221238
• Reliure: Relié
• Nombre de pages: 300
• Éditeur: Joshi Rajiv, Ziegler Matt, Kumar Arvind, Alarcon Eduard
• Coordonnées du fabricant: non disponible
• Personne responsable: gpsr@libri.de; gpsr@libri.de; ; Friedensallee 273; Hamburg; 22763; Allemagne