Bonding in Microsystem Technology - Couverture souple

Dziuban, Jan A.

Couverture souple

ISBN 10 : 9048171512 ISBN 13 : 9789048171514

Editeur : Springer, 2010

Synopsis

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

A propos du livre

Présentation de l'éditeur

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2010
• Langue: anglais
• ISBN 10: 9048171512
• ISBN 13: 9789048171514
• Reliure: Broché
• Nombre de pages: 352
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne