Synopsis
Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful "system on chip" ?rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ?ow is built, calibrated to silicon and used as part of the design and validation ?ows to uncover and ?x substrate coupling problems in RF ICs. The ?ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the ?oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.
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À propos de l?auteur
Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series
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Substrate Noise Coupling in RFICs (Analog Circuits and Signal Processing)
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful 'system on chip' rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ow is built, calibrated to silicon and used as part of the design and validation ows to uncover and x substrate coupling problems in RF ICs. The ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling. 136 pp. Englisch. N° de réf. du vendeur 9789048177899
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip(SoC) containing digital ICs as wellGreat reference for courses in RFIC and mixed signal ICs, and for design project coursesReports silicon measureme. N° de réf. du vendeur 5821625
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Taschenbuch. Etat : Neu. Substrate Noise Coupling in RFICs | Mohammed Ismail (u. a.) | Taschenbuch | xv | Englisch | 2010 | Springer | EAN 9789048177899 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. N° de réf. du vendeur 107207983
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Substrate Noise Coupling in RFICs
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ISBN 10 : 9048177898
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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful ¿system on chip¿ rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ow is built, calibrated to silicon and used as part of the design and validation ows to uncover and x substrate coupling problems in RF ICs. The ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 136 pp. Englisch. N° de réf. du vendeur 9789048177899
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