Articles liés à Substrate Noise Coupling in RFICs
Synopsis
Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful "system on chip" ?rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ?ow is built, calibrated to silicon and used as part of the design and validation ?ows to uncover and ?x substrate coupling problems in RF ICs. The ?ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the ?oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
À propos de l?auteur
Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
Acheter neuf
Afficher cet article
EUR 92,27
EUR 9,70 expédition depuis Allemagne vers France
Destinations, frais et délaisAutres éditions populaires du même titre
Résultats de recherche pour Substrate Noise Coupling in RFICs
Image fournie par le vendeur
Substrate Noise Coupling in RFICs
Edité par
Springer Netherlands, 2010
ISBN 10 : 9048177898
ISBN 13 : 9789048177899
Neuf
Couverture souple
Vendeur : moluna, Greven, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip(SoC) containing digital ICs as wellGreat reference for courses in RFIC and mixed signal ICs, and for design project coursesReports silicon measureme. N° de réf. du vendeur 5821625
Quantité disponible : Plus de 20 disponibles
Image fournie par le vendeur
Substrate Noise Coupling in RFICs
Edité par
Springer Netherlands, Springer Netherlands Nov 2010, 2010
ISBN 10 : 9048177898
ISBN 13 : 9789048177899
Neuf
Taschenbuch
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful ¿system on chip¿ rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ow is built, calibrated to silicon and used as part of the design and validation ows to uncover and x substrate coupling problems in RF ICs. The ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 136 pp. Englisch. N° de réf. du vendeur 9789048177899
Quantité disponible : 1 disponible(s)
Image fournie par le vendeur
Substrate Noise Coupling in RFICs
Edité par
Springer Netherlands, Springer Netherlands, 2010
ISBN 10 : 9048177898
ISBN 13 : 9789048177899
Neuf
Taschenbuch
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful 'system on chip' rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ow is built, calibrated to silicon and used as part of the design and validation ows to uncover and x substrate coupling problems in RF ICs. The ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling. N° de réf. du vendeur 9789048177899
Quantité disponible : 1 disponible(s)
Image d'archives
Substrate Noise Coupling in RFICs (Analog Circuits and Signal Processing)
Vendeur : California Books, Miami, FL, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. N° de réf. du vendeur I-9789048177899
Quantité disponible : Plus de 20 disponibles
Image d'archives
Substrate Noise Coupling in RFICs
Vendeur : Books Puddle, New York, NY, Etats-Unis
Évaluation du vendeur 4 sur 5 étoiles
Etat : New. pp. 136. N° de réf. du vendeur 2614416133
Quantité disponible : 4 disponible(s)
Image d'archives
Substrate Noise Coupling in RFICs (Analog Circuits and Signal Processing)
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. In. N° de réf. du vendeur ria9789048177899_new
Quantité disponible : Plus de 20 disponibles
Image d'archives
Substrate Noise Coupling in RFICs
impression à la demandeVendeur : Majestic Books, Hounslow, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. Print on Demand pp. 136 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam. N° de réf. du vendeur 11290330
Quantité disponible : 4 disponible(s)
Image d'archives
Substrate Noise Coupling in RFICs
impression à la demandeVendeur : Biblios, Frankfurt am main, HESSE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. PRINT ON DEMAND pp. 136. N° de réf. du vendeur 1814416143
Quantité disponible : 4 disponible(s)
Image fournie par le vendeur
Substrate Noise Coupling in RFICs
Edité par
Springer Netherlands Nov 2010, 2010
ISBN 10 : 9048177898
ISBN 13 : 9789048177899
Neuf
Taschenbuch
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors' knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC. 136 pp. Englisch. N° de réf. du vendeur 9789048177899
Quantité disponible : 2 disponible(s)
Image d'archives
Substrate Noise Coupling in RFICs
Vendeur : Revaluation Books, Exeter, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Paperback. Etat : Brand New. 136 pages. 9.00x6.00x0.31 inches. In Stock. N° de réf. du vendeur x-9048177898
Quantité disponible : 2 disponible(s)