High Performance Design Automation for Multi-Chip Modules and Packages - Couverture rigide

 
9789810223076: High Performance Design Automation for Multi-Chip Modules and Packages
Couverture rigide
ISBN 10 : 9810223072 ISBN 13 : 9789810223076
Editeur : World Scientific Publishing Co Pte Ltd, 1996

Synopsis

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Éditeur
World Scientific Publishing Co Pte Ltd
Date d'édition
1996
Langue
anglais
ISBN 10 
9810223072
ISBN 13 
9789810223076
Reliure
Relié
Nombre de pages
264
Éditeur
Cho Jun Dong, Franzon Paul D
Coordonnées du fabricant
non disponible
Personne responsable
non disponible