Articles liés à High Performance Design Automation for Multi-Chip Modules...
Synopsis
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
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High Performance Design Automation for Multi-Chip Modules and Packages
Edité par
World Scientific Publishing Company, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Ancien ou d'occasion
Couverture rigide
Vendeur : La bataille des livres, Pradinas, France
Évaluation du vendeur 5 sur 5 étoiles
Etat : Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |. N° de réf. du vendeur 00-QHTT-IRAJ
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EUR 13,76
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Selected Topics in Electronics and Systems)
Edité par
World Scientific Publishing Company, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Neuf
Couverture rigide
Vendeur : Russell Books, Victoria, BC, Canada
Évaluation du vendeur 5 sur 5 étoiles
hardcover. Etat : New. Special order direct from the distributor. N° de réf. du vendeur ING9789810223076
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
Edité par
World Scientific Publishing Co Pte Ltd, Singapore, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Neuf
Couverture rigide
Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Hardcover. Etat : new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9789810223076
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High Performance Design Automation for Multi-Chip Modules and Packages
Edité par
WORLD SCIENTIFIC PUB CO INC, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Neuf
Couverture rigide
Vendeur : moluna, Greven, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti. N° de réf. du vendeur 909655129
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EUR 109,48
Expédition à EUR 48,99
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High Performance Design Automation for Multi-Chip Modules and Packages (Current Topics in Electronics and Systems, Vol 5)
Edité par
World Scientific Pub Co Inc, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Neuf
Couverture rigide
Vendeur : Revaluation Books, Exeter, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Hardcover. Etat : Brand New. 254 pages. 10.25x7.00x0.75 inches. In Stock. N° de réf. du vendeur x-9810223072
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EUR 146,11
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High Performance Design Automation for Multi-Chip Modules and Packages (Current Topics in Electronics and Systems, Vol 5)
Edité par
World Scientific Pub Co Inc, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Ancien ou d'occasion
Couverture rigide
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
Évaluation du vendeur 4 sur 5 étoiles
Hardcover. Etat : Like New. Like NewLIKE NEW. book. N° de réf. du vendeur ERICA85498102230723
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EUR 152,25
Expédition à EUR 29,10
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
Edité par
World Scientific Publishing Co Pte Ltd, Singapore, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Neuf
Couverture rigide
Vendeur : AussieBookSeller, Truganina, VIC, Australie
Évaluation du vendeur 5 sur 5 étoiles
Hardcover. Etat : new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. N° de réf. du vendeur 9789810223076
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EUR 181,79
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High Performance Design Automation For Multi-Chip Modules and Packages (Volume 5)
Edité par
World Scientific Publishing, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Neuf
Couverture rigide
Vendeur : Kennys Bookstore, Olney, MD, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Books ship from the US and Ireland. N° de réf. du vendeur V9789810223076
Acheter neuf
EUR 212,96
Expédition à EUR 9,04
Expédition nationale : Etats-Unis
Expédition nationale : Etats-Unis
Quantité disponible : 10 disponible(s)
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High Performance Design Automation For Multi-Chip Modules and Packages (Volume 5)
Edité par
World Scientific Publishing, 1996
ISBN 10 : 9810223072
ISBN 13 : 9789810223076
Neuf
Couverture rigide
Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlande
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . N° de réf. du vendeur V9789810223076
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EUR 243,03
Expédition à EUR 9,50
Expédition depuis Irlande vers Etats-Unis
Expédition depuis Irlande vers Etats-Unis
Quantité disponible : 10 disponible(s)