Transactions on Engineering Technologies: World Congress on Engineering and Computer Science 2015 - Couverture rigide

 
9789811027161: Transactions on Engineering Technologies: World Congress on Engineering and Computer Science 2015

Synopsis

This proceedings volume contains selected revised and extended research articles written by researchers who participated in the World Congress on Engineering and Computer Science 2015, held in San Francisco, USA, 21-23 October 2015. Topics covered include engineering mathematics, electrical engineering, circuits, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications.

The book offers the reader an overview of the state of the art in engineering technologies, computer science, systems engineering and applications, and will serve as an excellent reference work for researchers and graduate students working in these fields.

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À propos de l?auteur

Dr. Sio-Iong Ao finished his doctoral research in The University of Hong Kong and postdoctoral researches in the University of Oxford and Harvard University and is a former visiting professor of Cranfield University, UK and University of Wyoming, USA.

Dr. Haeng-Kon Kim is currently a Dean of engineering college and a professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA center in U.S.A. He has taught in Central Michigan Univ. in U.S.A. during his Sabbatical (Dec., 20, 2000 Feb., 20,2002).

Prof. Mahyar A. Amouzegar is a Dean of College of Engineering, California State Polytechnic University, Pomona, USA.




Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Autres éditions populaires du même titre

9789811096914: Transactions on Engineering Technologies: World Congress on Engineering and Computer Science 2015

Edition présentée

ISBN 10 :  9811096910 ISBN 13 :  9789811096914
Editeur : Springer Verlag, Singapore, 2018
Couverture souple