Introduction to Thermal Cloaking: Theory and Analysis in Conduction and Convection - Couverture rigide

Yeung, Woon-shing; Yang, Ruey-jen

Couverture rigide

ISBN 10 : 981167549X ISBN 13 : 9789811675492

Editeur : Springer Verlag, Singapore, 2021

Synopsis

<p>This book introduces the fundamental concepts of thermal cloaking based on transformation theory and bilayer theory, under the conduction and convection heat transfer modes.&nbsp;It focuses on thermal cloaking with detailed explanations of the underlying theoretical bases leading to the primary thermal cloaking results in open literature, from an engineering perspective, and with practical application in mind. Also, the authors strive to present the materials with an emphasis on the related physical phenomena and interpretation, to the extent possible. Through this book, engineering students can grasp the fundamental ideas of thermal cloaking and the associated mathematics, thus being better able to initiate their own research and explore new ideas in thermal cloaking.&nbsp;&nbsp;</p><p> </p><p>While not intended to be a general reference in the vast field of thermal cloaking research, this book is a unique monograph addressing the theoretical and analytical aspects of thermal cloaking within the scope mentioned above. This book also contains many independent analytical solutions to thermal cloaking problems that are not available in open literature. It is suitable for a three-credit graduate or advanced undergraduate course in engineering science.</p><p>&nbsp;</p><br><br>

A propos du livre

À propos de l'auteur

<p><b>Woon-Shing Yeung</b>: Since receiving his&nbsp;Ph.D. from the University of California at Berkeley in 1979, Dr. Yeung has spent over ten years in&nbsp;academia&nbsp;teaching in the&nbsp;Mechanical&nbsp;Engineering Department at&nbsp;the&nbsp;University of Massachusetts at Lowell,&nbsp;and over 25 years working in industry in the USA. Currently, he is a Visiting Specialist at National Cheng Kung University&nbsp;in Taiwan, engaging in thermal cloaking research and teaching, and has co-authored a few publications on thermal cloaking.&nbsp;&nbsp;</p><p></p><p></p><p><b>Ruey-Jen Yang</b>:&nbsp;Dr. Yang&nbsp;has&nbsp;worked&nbsp;in industry in the USA&nbsp;for&nbsp;over 10 years after receiving&nbsp;his&nbsp;Ph.D. from the University of California at Berkeley in 1982.&nbsp;Professor&nbsp;Yang&nbsp;joined&nbsp;the&nbsp;National Cheng Kung University&nbsp;since 1993 and currently is a Chair Professor and a research fellow of the Taiwan Ministry of Science and Technology. He is also a fellow of&nbsp;the&nbsp;American Society of Mechanical Engineers (ASME) and Society of Theoretical and Applied Mechanics (STAM). His research focuses on Fluid/Thermal Sciences, Microfluidics and Energy Conversion.&nbsp;&nbsp;&nbsp;<br></p><br>

À propos de la quatrième de couverture

<p>This book introduces the fundamental concepts of thermal cloaking based on transformation theory and bilayer theory, under the conduction and convection heat transfer modes.&nbsp;It focuses on thermal cloaking with detailed explanations of the underlying theoretical bases leading to the primary thermal cloaking results in open literature, from an engineering perspective, and with practical application in mind. Also, the authors strive to present the materials with an emphasis on the related physical phenomena and interpretation, to the extent possible. Through this book, engineering students can grasp the fundamental ideas of thermal cloaking and the associated mathematics, thus being better able to initiate their own research and explore new ideas in thermal cloaking.&nbsp;&nbsp;</p><p> </p><p>While not intended to be a general reference in the vast field of thermal cloaking research, this book is a unique monograph addressing the theoretical and analytical aspects of thermal cloaking within the scope mentioned above. This book also contains many independent analytical solutions to thermal cloaking problems that are not available in open literature. It is suitable for a three-credit graduate or advanced undergraduate course in engineering science.</p><p>&nbsp;</p><div><br></div>

Détails de l'édition

• Éditeur: Springer Verlag, Singapore
• Date d'édition: 2021
• Langue: anglais
• ISBN 10: 981167549X
• ISBN 13: 9789811675492
• Reliure: Relié
• Nombre de pages: 259
• Coordonnées du fabricant: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Allemagne