Thermal Reliability of Power Semiconductor Device in the Renewable Energy System - Couverture rigide

Du, Xiong; Zhang, Jun; Li, Gaoxian; Yu, Yaoyi; Qian, Cheng; Du, Rui

Couverture rigide

ISBN 10 : 9811931313 ISBN 13 : 9789811931314

Editeur : Springer Verlag, Singapore, 2022

Synopsis

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management.

A propos du livre

À propos de l?auteur

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.
Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

Détails de l'édition

• Éditeur: Springer Verlag, Singapore
• Date d'édition: 2022
• Langue: anglais
• ISBN 10: 9811931313
• ISBN 13: 9789811931314
• Reliure: Relié
• Nombre de pages: 188
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne