Articles liés à Thermal Reliability of Power Semiconductor Device in...

Thermal Reliability of Power Semiconductor Device in the Renewable Energy System - Couverture rigide

Du, Xiong; Zhang, Jun; Li, Gaoxian; Yu, Yaoyi; Qian, Cheng; Du, Rui

 
9789811931314: Thermal Reliability of Power Semiconductor Device in the Renewable Energy System
Couverture rigide
ISBN 10 : 9811931313 ISBN 13 : 9789811931314
Editeur : Springer Verlag, Singapore, 2022

Synopsis

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l'auteur

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.
Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Springer Verlag, Singapore
Date d'édition
2022
Langue
anglais
ISBN 10 
9811931313
ISBN 13 
9789811931314
Reliure
Relié
Nombre de pages
188
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