3D Integration for VLSI Systems - Couverture rigide

 
9789814303811: 3D Integration for VLSI Systems
Couverture rigide
ISBN 10 : 981430381X ISBN 13 : 9789814303811
Editeur : Pan Stanford Publishing Pte Ltd, 2011

Synopsis

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l?auteur

Chuan Seng Tan, Kuan-Neng Chen

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Pan Stanford Publishing Pte Ltd
Date d'édition
2011
Langue
anglais
ISBN 10 
981430381X
ISBN 13 
9789814303811
Reliure
Relié
Nombre de pages
378
Éditeur
Tan Chuan Seng, Chen Kuan-Neng, Koester Steven J.
Coordonnées du fabricant
Taylor & Francis
https://taylorandfrancis.com/knowledge/

6000 BROKEN SOUND PARKWAY, NW SUITE 300
BOCA RATON
FL
22487
Etats-Unis
Personne responsable
non disponible