Articles liés à Design and Modeling for 3D ICs and Interposers

Design and Modeling for 3D ICs and Interposers - Couverture rigide

Livre 2 sur 7: WSPC Series in Advanced Integration and Packaging

Swaminathan, Madhavan; Han, Ki Jin

 
9789814508599: Design and Modeling for 3D ICs and Interposers
Couverture rigide
ISBN 10 : 9814508594 ISBN 13 : 9789814508599
Editeur : World Scientific Publishing Co Pte Ltd, 2013

Synopsis

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Éditeur
World Scientific Publishing Co Pte Ltd
Date d'édition
2013
Langue
anglais
ISBN 10 
9814508594
ISBN 13 
9789814508599
Reliure
Relié
Nombre de pages
380
Coordonnées du fabricant
non disponible
Personne responsable
gpsr@libri.de
gpsr@libri.de

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