Fabless Semiconductor Manufacturing: In the Era of Internet of Things - Couverture rigide

Couverture rigide

ISBN 10 : 9814968277 ISBN 13 : 9789814968270

Editeur : Jenny Stanford Publishing, 2022

Synopsis

This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.

A propos du livre

À propos de l'auteur

Chinmay K. Maiti is a retired professor and former head of the department, Indian Institute of Technology Kharagpur, India, and currently a visiting professor at SOA University, Bhubaneswar, India. He is interested in strain-engineering in nanodevices, flexible/stretchable electronics, and nanoscale semiconductor device/process simulation research, and microelectronics education. Prof. Maiti has published several monographs on silicon-germanium, heterostructure-silicon, and technology computer-aided design and edited Selected Works of Professor Herbert Kroemer (2008).

Détails de l'édition

• Éditeur: Jenny Stanford Publishing
• Date d'édition: 2022
• Langue: anglais
• ISBN 10: 9814968277
• ISBN 13: 9789814968270
• Reliure: Relié
• Nombre de pages: 324
• Éditeur: Maiti Chinmay K.
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible