Reliability Technology for Integrated Circuit Packaging - Couverture rigide

Zhou, Bin; En, Yunfei; Chen, Si

Couverture rigide

ISBN 10 : 981953884X ISBN 13 : 9789819538843

Editeur : Springer Verlag, Singapore, 2026

Synopsis

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

A propos du livre

À propos de l'auteur

Prof. Canbing Li is engaged in energy saving and smart grid research, and was awarded 2012 New Century Excellent Talents in University of China, Granted by Ministry of Education, China. He has successfully secured national 863 project, national science and technology support sub-plan, the national natural science fund project. Professor Li is IEEE senior member and evaluation experts of national energy conservation center. Prof. Yijia Cao is engaged in smart grid and energy strategy research and has successfully secured outstanding youth fund of national natural science fund project, key project of national natural science funds, national 973 program, national 863 program, national international technology cooperation plan. He is also the Yangtze river scholars distinguished professor and subject matter experts in "twelfth five-year" energy sector of ministry of science and technology. Now he is vice president of Hunan University.

Ms. Kuang Yonghong is PhD student at College of Electrical and Information Engineering and Dr. Bin Zhou is Assistant Professor at College of Electrical and Information Engineering of Hunan University.

À propos de la quatrième de couverture

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Détails de l'édition

• Éditeur: Springer Verlag, Singapore
• Date d'édition: 2026
• Langue: anglais
• ISBN 10: 981953884X
• ISBN 13: 9789819538843
• Reliure: Relié
• Nombre de pages: 450
• Coordonnées du fabricant: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Allemagne