Reliability Technology for Integrated Circuit Packaging - Couverture rigide

Zhou, Bin ; En, Yunfei ; Chen, Si

9789819538843: Reliability Technology for Integrated Circuit Packaging

Couverture rigide

ISBN 10 : 981953884X ISBN 13 : 9789819538843

Editeur : Springer Verlag, Singapore, 2026

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This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Les informations fournies dans la section � Synopsis � peuvent faire r�f�rence � une autre �dition de ce titre.

�diteur: Springer Verlag, Singapore
Date d'�dition: 2026
Langue: anglais
ISBN 10: 981953884X
ISBN 13: 9789819538843
Reliure: Reli�
Nombre de pages: 538
Coordonn�es du fabricant: KINESIS
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Reliability Technology for Integrated Circuit Packaging

Zhou, Bin/En, Yunfei/Chen, Si

Edit� par Springer Verlag GmbH, 2026

ISBN 10 : 981953884X ISBN 13 : 9789819538843

Neuf Couverture rigide

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Vendeur : moluna, Greven, Allemagne

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. N� de r�f. du vendeur 2636420446

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Reliability Technology for Integrated Circuit Packaging

Bin Zhou

Edit� par Springer-Verlag Gmbh Apr 2026, 2026

ISBN 10 : 981953884X ISBN 13 : 9789819538843

Neuf Couverture rigide

impression � la demande

Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of 'high-quality development' a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry. 510 pp. Englisch. N� de r�f. du vendeur 9789819538843

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EUR 171,19

Exp�dition �EUR 23
Exp�dition depuis Allemagne vers Etats-Unis

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Reliability Technology for Integrated Circuit Packaging

Bin Zhou

Edit� par Springer, Springer Apr 2026, 2026

ISBN 10 : 981953884X ISBN 13 : 9789819538843

Neuf Couverture rigide

impression � la demande

Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Buch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 540 pp. Englisch. N� de r�f. du vendeur 9789819538843

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EUR 171,19

Exp�dition �EUR 60
Exp�dition depuis Allemagne vers Etats-Unis

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Reliability Technology for Integrated Circuit Packaging

Bin Zhou

Edit� par Springer, Springer, 2026

ISBN 10 : 981953884X ISBN 13 : 9789819538843

Neuf Couverture rigide

Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

�valuation du vendeur 5 sur 5 �toiles

Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of 'high-quality development' a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry. N� de r�f. du vendeur 9789819538843

Contacter le vendeur