Embedded Artificial Intelligence: Principles, Platforms and Practices - Couverture souple

Li, Bin

 
9789819750375: Embedded Artificial Intelligence: Principles, Platforms and Practices
Couverture souple
ISBN 10 : 9819750377 ISBN 13 : 9789819750375
Editeur : Springer, 2024

Synopsis

This book focuses on the emerging topic of embedded artificial intelligence and provides a systematic summary of its principles, platforms, and practices. In the section on principles, it analyzes three main approaches for implementing embedded artificial intelligence: cloud computing mode, local mode, and local-cloud collaborative mode. The book identifies five essential components for implementing embedded artificial intelligence: embedded AI accelerator chips, lightweight neural network algorithms, model compression techniques, compiler optimization techniques, and multi-level cascaded application frameworks. The platform section introduces mainstream embedded AI accelerator chips and software frameworks currently used in the industry. The practical part outlines the development process of embedded artificial intelligence and showcases real-world application examples with accompanying code.

As a comprehensive guide to the emerging field of embedded artificial intelligence, the book offers rich and in-depth content, a clear and logical structure, and a balanced approach to both theoretical analysis and practical applications. It provides significant reference value and can serve as an introductory and reference guide for researchers, scholars, students, engineers, and professionals interested in studying and implementing embedded artificial intelligence.

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À propos de l?auteur

Bin Li held chief technical positions in several Fortune 500 companies, and he earned a Master's degree in pattern recognition and artificial intelligence from Beijing Institute of Technology. His research areas include artificial intelligence, distributed computing, and data communication. He is the first inventor of over 20 Chinese and international invention patents.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
Springer
Date d'édition
2024
Langue
anglais
ISBN 10 
9819750377
ISBN 13 
9789819750375
Reliure
Broché
Nombre de pages
272
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