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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications: Proceedings of 8th International Conference on Microelectronics ... and Telecommunications (Icmeet 2023) - Couverture rigide
- ÉditeurSpringer Nature
- Date d'édition2024
- ISBN 10 9819784212
- ISBN 13 9789819784219
- ReliureRelié
- Langueanglais
- Nombre de pages523
- ÉditeurBhateja Vikrant, Chakravarthy V. V. S. S. S, Anguera Jaume, Ghosh Anumoy, Flores Fuentes Wendy
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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications
Edité par
Springer, Berlin, Springer Nature Singapore, Springer, 2024
ISBN 10 : 9819784212
ISBN 13 : 9789819784219
Neuf
Couverture rigide
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society. 523 pp. Englisch. N° de réf. du vendeur 9789819784219
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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications : Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Edité par
Springer Nature Singapore, Springer Nature Singapore, 2024
ISBN 10 : 9819784212
ISBN 13 : 9789819784219
Neuf
Couverture rigide
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society. N° de réf. du vendeur 9789819784219
Quantité disponible : 1 disponible(s)