Proceedings of 17th Symposium on Earthquake Engineering (Vol. 2) - Couverture souple

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9789819916061: Proceedings of 17th Symposium on Earthquake Engineering (Vol. 2)

Synopsis

This book presents select proceedings of the 17th Symposium on Earthquake Engineering organized by the Department of Earthquake Engineering, Indian Institute of Technology Roorkee.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

À propos de l?auteur

Dr. Manish Shrikhande is Professor and Head of the Department of Earthquake Engineering at Indian Institute of Technology Roorkee. His current research interests are vibration monitoring and control, seismic risk and mitigation, and computational mechanics.

Dr. Pankaj Agarwal is Professor at the Department of Earthquake Engineering, Indian Institute of Technology Roorkee. His research interests are earthquake-resistant design of masonry and RC structures, post-damage assessment survey of earthquake-affected areas, risk assessment, cyclic testing of structures, seismic instrumentation in multi-storied buildings, health monitoring, and damage detection in buildings. He is continuously engaged in research on structurally sound and seismically efficient construction and has published several research papers in national and international journals and conferences/seminars/symposia.

Dr. P. C. Ashwin Kumar is Assistant Professor at the Department of Earthquake Engineering, Indian Institute of Technology Roorkee. He has been engaged in teaching and research in earthquake-resistant design of steel structures, development of passive devices for seismic protection, vulnerability assessment, and retrofitting of structures.


Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Autres éditions populaires du même titre

9789819916030: Proceedings of 17th Symposium on Earthquake Engineering

Edition présentée

ISBN 10 :  9819916038 ISBN 13 :  9789819916030
Editeur : Springer Verlag, Singapore, 2023
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