Handbook of Emerging Materials for Semiconductor Industry - Couverture rigide

Couverture rigide

ISBN 10 : 9819966485 ISBN 13 : 9789819966486

Editeur : Springer Verlag, Singapore, 2024

Synopsis

The proposed book will be a "one-stop" place for all the young material researchers to understand the recent and reliable material making process, characterization, and reliability test tools. The proposed book is designed to provide basic knowledge to understand and analyse structure-property relationship for reliable emerging material systems for next generation of semiconductor technologies.
The book is suggested to engineers and scientists across the world working on various new and novel materials for reliable semiconductor device applications. The book is expected to serve as a reference guide for young scientists and engineers in the field of material science and electronic engineers to acquire latest state-of-art experimental and computational tools to encourage their research activities.
Since the scope of the book is generic, the book can be referred by all the students of science and engineering students to create a common awareness about the latest material systems and state-of-art characterization tools that have been broadly utilized to study the physical and chemical properties of different material systems.
It introduces the readers to a wide variety of new emerging materials systems including their synthesis, fabrication, measurement, reliability test, modelling and simulations with in-depth analysis of selective applications.
This book contains the state-of-art research updates in the various fields of semiconductor, artificial intelligence (AI), bio-sensor, biotechnology, with respect to reliable material research. Therefore, various students who are eager to get a job in semiconductor/AI/Autonomous car/biotechnology are strongly recommended to read this book and learn about related state-of-art knowledge.

A propos du livre

À propos de l'auteur

Prof. Young Suh Song is a(n): ​

• IEEE Technical Committee (USA), IEEE ICCSS (2022 - Present)
• Assistant Professor, Department of Computer Science, Korea Military Academy (2021 - Present)
• Full Time Lecturer, Department of Computer Science, Korea Military Academy (2020 - 2021)
• Research Interests - Emerging Materials, Nanomaterials, Nanotechnology, Semiconductor
• Best Paper Award - IEEE International Conference on Circuits, Systems and Simulation, 2022.
• Best Paper Award - Journal of the Institute of Electronics and Information Engineers
• Editorial Work - Wiley (USA), CRC Press (USA)
• Chapter Contributor - Springer, CRC Press (USA)
• Journal Reviewer - IEEE Transactions on Electron Devices (USA),
• ECS Journal of Solid State Science and Technology (UK)

Dr. Laxman Raju Thoutam received his Ph.D. from Northern Illinois University, DeKalb, USA. He is currently Assistant Professor at Amrita School of Nanosciences and Molecular Medicine, Amrita Vishwa Vidyapeetham, Kochi, Kerala, India. His research interests are in the areas of nanoscience, materials science and device physics.

Dr. Shubham Tayal receive his Ph.D. from NIT Kurukshetra, India. He is currently Assistant Professor at SR University, Warangal, India. His research interests are in the areas of VLSI design and microelectronics.

Dr. Shiromani Balmukund Rahi received his Ph.D. from Indian Institute of Technology, Kanpur, India. His research interests are in the areas of semiconductor and nanodevices.

Prof. T. S. Arun Samuel is a Full Professor of Dept. of Electronics and Communication Engineering, National Engineering College, K.R. Nagar.

Détails de l'édition

• Éditeur: Springer Verlag, Singapore
• Date d'édition: 2024
• Langue: anglais
• ISBN 10: 9819966485
• ISBN 13: 9789819966486
• Reliure: Relié
• Nombre de pages: 959
• Éditeur: Song Young Suh, Thoutam Laxman Raju, Tayal Shubam, Rahi Shiromani Balmukund, Samuel T. S. Arun
• Coordonnées du fabricant: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Allemagne