Semiconductor Manufacturing Handbook: Wafer Fabrication, Photolithography, Process Integration, Cleanroom Operations, Yield Improvement, and Quality Control - Couverture souple

Whitfield, Marcus T.

Couverture souple

ISBN 13 : 9798193992776

Editeur : Independently published, 2026

Synopsis

SEMICONDUCTOR MANUFACTURING HANDBOOK

Semiconductor manufacturing is a complex chain of tightly controlled processes. A small variation in film thickness, critical dimension, contamination level, etch profile, or equipment performance can affect everything that follows.

Semiconductor Manufacturing Handbook provides a practical, engineering-focused guide to how modern semiconductor fabs actually build devices, control processes, investigate problems, and improve yield.

Starting with semiconductor materials and wafer preparation, the book follows the manufacturing flow through cleanroom operations, oxidation, photolithography, etching, ion implantation, deposition, chemical mechanical planarization, and process integration. It then moves beyond individual process steps to the systems that determine whether a fab is performing successfully: metrology, statistical process control, yield analysis, failure analysis, equipment reliability, and quality management.

Inside, readers will learn about:

• Semiconductor materials and crystal growth
• Wafer slicing, polishing, gettering, SOI, and wafer reclaim
• Cleanroom classification and contamination control
• Oxidation and thin-film fundamentals
• Photoresist processing and photolithography
• Resolution, depth of focus, overlay, immersion lithography, and EUV
• Wet etching and reactive ion etching
• Ion implantation, doping, channeling, and annealing
• CVD, PVD, PECVD, LPCVD, and ALD
• Chemical mechanical planarization and endpoint detection
• FEOL, MOL, BEOL, and process integration
• CD-SEM, ellipsometry, profilometry, and in-line metrology
• Cp, Cpk, control charts, and statistical process control
• Yield models, wafer-map analysis, and failure analysis
• Preventive and predictive equipment maintenance
• OEE, SEMI E10, ISO 9001, Six Sigma, DMAIC, OSHA, and NFPA considerations
• Advanced packaging, 2.5D/3D integration, High-NA EUV, GAA devices, and emerging interconnect materials

This handbook is designed for entry-level semiconductor technicians, apprentices, technical college students, trainees, and junior process engineers who want to understand not only what happens on a fab floor, but why each process matters and how problems are diagnosed.

Worked calculations, diagnostic case studies, practice problems, cross-references, a glossary, standards reference table, and unit conversions make the book suitable both as a learning resource and as a practical reference.

Whether you are preparing for semiconductor manufacturing work, building your process-engineering knowledge, or looking for a single reference that connects semiconductor physics, chemistry, equipment, process control, economics, and yield, this handbook provides a structured foundation for understanding modern fab operations.

Détails de l'édition

• Éditeur: Independently published
• Date d'édition: 2026
• Langue: anglais
• ISBN 13: 9798193992776
• Reliure: Broché
• Nombre de pages: 507
• Coordonnées du fabricant: Manufactured by Amazon on behalf of the author; https://www.amazon.fr/hz/contact-us; ; c/o Amazon Media EU S.à.r.l., 38 Avenue John F. Kennedy; Luxembourg; L-1855; Luxembourg