A Journey Through Grace - Couverture souple

Fung, Kit Mei

Couverture souple

ISBN 13 : 9798218218966

Editeur : Chi, 2023

Synopsis

In this captivating memoir, Kit Mei Fung takes readers on an oftentimes shocking journey through her tumultuous past, revealing the profound experiences that have shaped her life. From her emotionally and physically painful relationship with her mother in poverty-stricken Hong Kong to her unexpected abandonment as a teenage immigrant in America, Kit faces unimaginable challenges. However, her unwavering faith becomes her salvation, empowering her to rise above her trauma and discover solace in her newfound spirituality. Kit’s tale of resilience and hope is a testament to the transformation power of God’s grace, inspiring readers to confront their own struggles and find the courage to heal. It reminds us that even in the darkest of times, we have the strength to triumph and emerge into the light.

Détails de l'édition

• Éditeur: Chi
• Date d'édition: 2023
• Langue: anglais
• ISBN 13: 9798218218966
• Reliure: Broché
• Nombre de pages: 325
• Coordonnées du fabricant: Manufactured by Amazon on behalf of the author; https://www.amazon.fr/hz/contact-us; ; c/o Amazon Media EU S.à.r.l., 38 Avenue John F. Kennedy; Luxembourg; L-1855; Luxembourg