Area Array Interconnection Handbook (Paperback)

Langue : anglais

Edité par Springer-Verlag New York Inc., New York, NY, 2012

146135529X / 9781461355298

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Paperback. Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

N° de réf. du vendeur 9781461355298

Titre
Area Array Interconnection Handbook (Paperback)
Auteur
Karl J. Puttlitz
Éditeur
Springer-Verlag New York Inc., New York, NY
Année de publication
2012
État de l'article
new
Reliure
Paperback
Langue
anglais
ISBN à 10 chiffres
146135529X
ISBN à 13 chiffres
9781461355298

AussieBookSeller

Truganina, VIC, Australie

Vendeur avec une évaluation de 5 étoiles

Vendeur AbeBooks depuis 22 juin 2007

Frais d'expédition de Australie vers Etats-Unis

Article25 à 45 jours ouvrés8 à 14 jours ouvrés
Premier articleEUR 32,28EUR 38,38
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