Comprehensive Microsystems. Cet article n’est pas disponible.
Langue : anglais
Edité par Elsevier Science Ltd, 2025
- Livre relié
- Neuf

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A propos de cet article
2nd edition. 2200 pages. 10.87x8.50 inches. In Stock.
N° de réf. du vendeur __0323954782
- Titre
- Comprehensive Microsystems
- Auteur
- Gianchandani, Yogesh B. (Editor)
- Éditeur
- Elsevier Science Ltd
- Année de publication
- 2025
- État de l'article
- Brand New
- Reliure
- Hardcover
- Langue
- anglais
- ISBN à 10 chiffres
- 0323954782
- ISBN à 13 chiffres
- 9780323954785
- Édition
- 2ème Édition
- Poids de l'article
- 1 kilogramme
The microsystems field has expanded to embrace a host of technologies, and microelectronics has now been joined by micro-mechanics, micro-fluidics and micro-optics to allow the fabrication of complex, multi- functional integrated microsystems. Comprehensive Microsystems, Second Edition, Three Volume Set, represents the authoritative primary reference source on microsystems and is now newly updated to reflect the latest advances in this exciting engineering field. This major reference work provides an exhaustive overview of the range of topics which comprise the microsystems field, including, design and materials, fabrication and packaging, optical systems, chemical and biological systems, physical sensors, actuation, electronics for MEMS and industrial applications. The new edition has been considerably revised and updated to include newer technologies such as ultrafast laser machining, 3D printing for biomedical applications, wearable sensors, microanalytical systems, and more. Each expertly written article provides a concise overview of a particular aspect of microsystems, and is accompanied by extensive references, guiding the user to the most relevant further reading within the ever-expanding available literature.
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À propos de l’auteur
Yogesh B. Gianchandani is a Professor at the University of Michigan, Ann Arbor, in the Department of Electrical Engineering and Computer Science, with a courtesy appointment in the Mechanical Engineering Department. He also serves as the Director for the Engineering Research Center for Wireless Integrated Microsystems (WIMS). Dr. Gianchandani’s research interests include the design, fabrication, and packaging of micromachined sensors and actuators. He is a fellow of IEEE and serves as an editor or board member of several journals.
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