Electronic Packaging Materials and Their Properties. Cet article n’est pas disponible.
Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus; Mahajan, Rahul
Langue : anglais
Edité par CRC Press, 1998
- Livre relié
- Neuf
Vendeur : Ria Christie Collections, Uxbridge, Royaume-UniRia Christie Collections
Vendeur avec une évaluation de 5 étoiles
Vendeur AbeBooks depuis 25 mars 2015
Indisponible
Livre relié
Etat: Neuf
EUR 300,86
A propos de cet article
In English.
N° de réf. du vendeur ria9780849396250_new
- Titre
- Electronic Packaging Materials and Their Properties
- Auteur
- Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus; Mahajan, Rahul
- Éditeur
- CRC Press
- Année de publication
- 1998
- État de l'article
- New
- Reliure
- Couverture rigide
- Langue
- anglais
- ISBN à 10 chiffres
- 0849396255
- ISBN à 13 chiffres
- 9780849396250
- Poids de l'article
- 474 grammes
- Série
- Livre 3 sur 4: Electronic Packaging
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
interconnections
printed circuit boards
substrates
encapsulants
dielectrics
die attach materials
electrical contacts
thermal materials
solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
« Synopsis » peut appartenir à une autre édition de cet ouvrage.
À propos de l’auteur
Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
« A propos de ce titre » peut appartenir à une autre édition de cet ouvrage.
Résultats de recherche pour Electronic Packaging Materials and Their Properties
Il reste 6 exemplaires de ce livre.Afficher tous les résultats