The Electronics Assembly Handbook

. Ed(s): Riley, Frank; Electronic Packaging and Production

ISBN 10: 3662131633 ISBN 13: 9783662131633

Edit� par Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, 2013

Neuf(s) Couverture souple

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Editor(s): Riley, Frank; Electronic Packaging and Production. Num Pages: 603 pages, biography. BIC Classification: TBC; TJFC; UKP. Category: (P) Professional & Vocational. Dimension: 254 x 203 x 32. Weight in Grams: 1343. . 2013. Softcover reprint of the original 1st ed. 1988. Paperback. . . . . Books ship from the US and Ireland. N� de r�f. du vendeur V9783662131633

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The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

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Titre : The Electronics Assembly Handbook
�diteur : Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Date d'�dition : 2013
Reliure : Couverture souple
Etat : New

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The Electronics Assembly Handbook

Riley, Frank|Electronic Packaging and Production

Edit� par Springer Berlin Heidelberg, 2013

ISBN 10 : 3662131633 ISBN 13 : 9783662131633

Neuf Couverture souple

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect. N� de r�f. du vendeur 5222110

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The Electronics Assembly Handbook

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The Electronics Assembly Handbook

Electronic Packaging and Production

Edit� par Springer Berlin Heidelberg, Springer Berlin Heidelberg Okt 2013, 2013

ISBN 10 : 3662131633 ISBN 13 : 9783662131633

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Taschenbuch. Etat : Neu. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch. N� de r�f. du vendeur 9783662131633

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The Electronics Assembly Handbook

Electronic Packaging and Production

Edit� par Springer Berlin Heidelberg, 2013

ISBN 10 : 3662131633 ISBN 13 : 9783662131633

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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. N� de r�f. du vendeur 9783662131633

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The Electronics Assembly Handbook

Electronic Packaging and Production

Edit� par Springer Berlin Heidelberg Okt 2013, 2013

ISBN 10 : 3662131633 ISBN 13 : 9783662131633

Neuf Taschenbuch

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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch. N� de r�f. du vendeur 9783662131633

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