MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â " 2011

MIKHAIL R. BAKLANOV, IMECGERAUD DUBOIS, IBM ALMADEN RESEARCH CENTERCHRISTIAN DUSSARRAT, AIR LIQUIDETERUKAZU KOKUBO, NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYSHINICHI OGAWA, JSR TSUKUBA RESEARCH LABORATORIES DIV CLASS="CONTRIBUTORSPEOPLE">DIV CLASS="CONTRIBUTORSPEOPLEHIDDEN">MARIANNA PANTOUVAKI, ANTHONY GRUNENWALD, SHOKO ONO, HEE-WOO RHEE, JOHN H. ZHANG, QUOC TOAN LE, SVEN ZIMMERMANN, VALERI AFANAS'EV, NAN LU, WIM BOGAERTS, SHAONING YAO, NEDA DALILI, JON GUDMUNDSSON, PATRIC

ISBN 10: 1605113123 / ISBN 13: 9781605113128

Edité par Materials Research Society, 2011

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Détails bibliographiques

• Titre: MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â " 2011
• Éditeur: Materials Research Society
• Date de parution: 2011
• Langue: anglais
• ISBN à 10 chiffres: 1605113123
• ISBN à 13 chiffres: 9781605113128
• Reliure: Couverture rigide
• État de l'article: Brand New

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Synopsis

This volume includes papers from 'Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics' symposium, 2011 MRS Spring Meeting.

Présentation de l'éditeur

This volume includes selected papers based on the presentations given at Symposium O, 'Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics', held at the April 25-29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.