Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition

R.R. Tummala/ Eugene J. Rymaszewski/ Alan G. Klopfenstein

ISBN 10: 0412085615 / ISBN 13: 9780412085611

Edité par Springer, 1998

A propos de cet article

2nd edition. 1000 pages. 7.00x7.25x1.00 inches. In Stock.

N° de réf. du vendeur x-0412085615

Détails bibliographiques

• Titre: Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition
• Éditeur: Springer
• Date de parution: 1998
• Langue: anglais
• ISBN à 10 chiffres: 0412085615
• ISBN à 13 chiffres: 9780412085611
• Reliure: CD-ROM
• Édition: 2ème Édition
• État de l'article: Brand New

A propos de ce titre

Synopsis

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.