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Titre : Simulation Of Semiconductor Processes And ...
Éditeur : Springer
Date d'édition : 2007
Reliure : Hardcover
Etat : New
Vendeur : Books in my Basket, New Delhi, Inde
Hardcover. Etat : New. ISBN: 9783211728604. N° de réf. du vendeur 1507250
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Vendeur : Buchpark, Trebbin, Allemagne
Etat : Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher | The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. N° de réf. du vendeur 3662543/12
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Vendeur : Buchpark, Trebbin, Allemagne
Etat : Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher | The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. N° de réf. du vendeur 3662543/2
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Vendeur : ALLBOOKS1, Direk, SA, Australie
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. N° de réf. du vendeur SHAK236442
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Vendeur : ALLBOOKS1, Direk, SA, Australie
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. N° de réf. du vendeur SHAK236441
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Vendeur : Basi6 International, Irving, TX, Etats-Unis
Etat : Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. N° de réf. du vendeur ABEOCT25-236443
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Vendeur : ALLBOOKS1, Direk, SA, Australie
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. N° de réf. du vendeur SHAK236443
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Vendeur : ALLBOOKS1, Direk, SA, Australie
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. N° de réf. du vendeur SHAK236444
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Vendeur : preigu, Osnabrück, Allemagne
Buch. Etat : Neu. Simulation of Semiconductor Processes and Devices 2007 | SISPAD 2007 | Siegfried Selberherr (u. a.) | Buch | Einband - flex.(Paperback) | Englisch | 2007 | Springer | EAN 9783211728604 | Verantwortliche Person für die EU: Springer-Verlag KG, Sachsenplatz 4-6, 1201 WIEN, ÖSTERREICH, productsafety[at]springernature[dot]com | Anbieter: preigu Print on Demand. N° de réf. du vendeur 102046954
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Vendeur : preigu, Osnabrück, Allemagne
Taschenbuch. Etat : Neu. Simulation of Semiconductor Processes and Devices 2007 | SISPAD 2007 | Siegfried Selberherr (u. a.) | Taschenbuch | xv | Englisch | 2017 | Springer | EAN 9783709119112 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. N° de réf. du vendeur 109009309
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