VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, . and Communication Technology, 680)

ISBN 10: 3031709462 / ISBN 13: 9783031709463

Edité par Springer, 2024

A propos de cet article

2024th edition NO-PA16APR2015-KAP.

N° de réf. du vendeur 26404050396

Détails bibliographiques

• Titre: VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, . and Communication Technology, 680)
• Éditeur: Springer
• Date de parution: 2024
• Langue: anglais
• ISBN à 10 chiffres: 3031709462
• ISBN à 13 chiffres: 9783031709463
• Reliure: Couverture rigide
• État de l'article: New

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Synopsis

This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023.
The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.