VLSI-SoC: Internet of Things Foundations | 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, Revised Selected Papers

Luc Claesen (u. a.)

ISBN 10: 331925278X / ISBN 13: 9783319252780

Edité par Springer International Publishing, 2015

A propos de cet article

VLSI-SoC: Internet of Things Foundations | 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, Revised Selected Papers | Luc Claesen (u. a.) | Buch | xiv | Englisch | 2015 | Springer International Publishing | EAN 9783319252780 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.

N° de réf. du vendeur 104240477

Détails bibliographiques

• Titre: VLSI-SoC: Internet of Things Foundations | 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, Revised Selected Papers
• Éditeur: Springer International Publishing
• Date de parution: 2015
• Langue: anglais
• ISBN à 10 chiffres: 331925278X
• ISBN à 13 chiffres: 9783319252780
• Reliure: Buch
• État de l'article: Neu
• Dimensions: 241 L x 160 H x 20 P (en millimètres) 241 millimètres de largeur par 160 millimètres de hauteur par 20 millimètres de profondeur
• Poids: 553 grammes
• Catalogues du vendeur:
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Synopsis

This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.