VLSI-SoC: Technologies for Systems Integration

Jürgen Becker

ISBN 10: 3642270727 / ISBN 13: 9783642270727

Edité par Springer Berlin Heidelberg, Springer Berlin Heidelberg Nov 2013, 2013

A propos de cet article

This item is printed on demand - Print on Demand Titel. Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 212 pp. Englisch.

N° de réf. du vendeur 9783642270727

Détails bibliographiques

• Titre: VLSI-SoC: Technologies for Systems Integration
• Éditeur: Springer Berlin Heidelberg, Springer Berlin Heidelberg Nov 2013
• Date de parution: 2013
• Langue: anglais
• ISBN à 10 chiffres: 3642270727
• ISBN à 13 chiffres: 9783642270727
• Reliure: Taschenbuch
• État de l'article: Neu
• Dimensions: 235 L x 155 H x 12 P (en millimètres) 235 millimètres de largeur par 155 millimètres de hauteur par 12 millimètres de profondeur
• Poids: 330 grammes

A propos de ce titre

Synopsis

This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.