Wireless Internet and mobile computing. Interoperability and performance,.

Kwok, Yu-Kwong:

ISBN 10: 0471679682 / ISBN 13: 9780471679684

Edité par Hoboken, New Jersey, IEEE Press Wiley-Interscience a John Wiley & Sons Inc. Publication, 2007

733 Ex-library book in GOOD condition, some traces of use, with stamp and signature. Ehem. Bibliotheksexemplar mit Stempel und Signatur, ein paar Gebrauchsspuren. 9780471679684 Sprache: Englisch Gewicht in Gramm: 1100. N° de réf. du vendeur 716317

Synopsis :

This book describes the technologies involved in all aspects of a large networking system and how the various devices can interact and communicate with each other. Using a bottom up approach, the authors demonstrate how it is feasible, for instance, for a cellular device user to communicate, via the all-purpose TCP/IP protocols, with a wireless notebook computer user, traversing all the way through a base station in a cellular wireless network (e.g., GSM, CDMA), a public switched network (PSTN), the Internet, an intranet, a local area network (LAN), and a wireless LAN access point. The information bits, in travelling through this long path, are processed by numerous disparate communication technologies. The authors also describe the technologies involved in infrastructure less wireless networks.

À propos de l?auteur: Yu-Kwong Ricky Kwok, PhD, is Associate Professor in the Department of Electrical and Computer Engineering at Colorado State University and is a Senior IEEE Member. Before joining CSU in August 2007, he was associate professor in the Department of Electrical and Electronic Engineering at the University of Hong Kong. Vincent K.N. Lau, PhD, is Associate Professor in the Department of Electrical Engineering at the Hong Kong University of Science and Technology and is a Senior IEEE Member. Kwok and Lau are also the authors of Channel-Adaptive Technologies and Cross-Layer Designs for Wireless Systems with Multiple Antennas (Wiley).

Détails bibliographiques

Titre : Wireless Internet and mobile computing. ...
Éditeur : Hoboken, New Jersey, IEEE Press Wiley-Interscience a John Wiley & Sons Inc. Publication
Date d'édition : 2007
Reliure : Couverture rigide